Analysis and optimization of the
curing process of epoxy resins can be easily carried out using
differential scanning calorimetry. Presented here is a measurement
on a glass fiber filled epoxy measured in the DSC 200 F3
Maia®. The two-step exothermal cross-linking
reaction slightly above the glass transition (at 101.5°C) is
clearly visible during the first heating of the sample. After
a controlled cooling at 5K/min, the sample was heated a second
time. Only a weak glass transition is visible at a higher temperature
(142.4°C) compared to the first heating cycle.
NETZSCH offers
precision thermal analysis instruments including advanced dilatometers (with
a new basic R&D/QC dilatometer),
classical DSC & TGA (with
a new economical DSC), high temperature DSC
to 1650°C for specific heat, very high temperature STA
(TGA-DSC/DTA) to 2400°C (featuring the new STA
409-PC Luxx®), thermal
/ evolved gas analysis with fully-integrated FTIR & MS, plus
high resolution TMA and DMA.
We also feature leading technology for thermal conductivity and diffusivity measurement
as well as refractories testing including HMOR, CIC, and RUL.
