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DSC 200 F3 Maia®

 
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Curing of an Epoxy Resin
  

Analysis and optimization of the curing process of epoxy resins can be easily carried out using differential scanning calorimetry. Presented here is a measurement on a glass fiber filled epoxy measured in the DSC 200 F3 Maia®. The two-step exothermal cross-linking reaction slightly above the glass transition (at 101.5°C) is clearly visible during the first heating of the sample. After a controlled cooling at 5K/min, the sample was heated a second time. Only a weak glass transition is visible at a higher temperature (142.4°C) compared to the first heating cycle.

  
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NETZSCH offers instruments for thermal analysis, thermal properties measurement, thermal hazard screening, and contract testing services. Our portfolio is the world's broadest, including a full range of dilatometers to measure high accuracy thermal expansion, classical DSC & TGA, high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) from sub-ambient to 2400°, thermal / evolved gas analysis with fully-integrated FTIR & MS, high resolution TMA and DMA, plus DEA - dielectric analysis for thermoset cure monitoring. We also feature leading-edge technology for thermal conductivity by guarded hot plate and heat flow meters, laser flash thermal diffusivity measurement, thermal hazard screening via adiabatic reaction calorimetry, as well as refractories testing including HMOR, CIC, and RUL. Finally, we offer advanced software packages including thermokinetics for process modeling and development.

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Last update: 05/27/2009 , Copyright © 2000-2006 NETZSCH-Geraetebau GmbH