NETZSCH - Leading Thermal Analysis.
 
 
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  Applications of Thermokinetics

 
 


  Differential Scanning Calorimetry

   

- Curing of epoxy resin 
-
Curing of epoxy resin with partial diffusion control 
-
Cross linking of powder paint
- Curing of electro-deposition paint
  

 


  Thermogravimetry

   

- Burnout of polymeric binder
-
Decomposition of glucose 
- Thermal decomposition of poly
  (diphenoxyphenyl-phenylenvinylene)

 


  Dilatometry

   

- Simulation of sintering behavior of Al2O
-
Sintering of Si3N4  

 


  Rheometry/Vulcametry

   

- Vulcanization of natural rubber
- Vulcanization including marching modulus and reversion
-
Cross linking of powder paint

 

 


NETZSCH offers instruments for thermal analysis, thermal properties measurement, thermal hazard screening, and contract testing services. Our portfolio is the world's broadest, including a full range of dilatometers to measure high accuracy thermal expansion, classical DSC & TGA, high temperature DSC to 1650°C for specific heat, very high temperature STA (TGA-DSC/DTA) from sub-ambient to 2400°, thermal / evolved gas analysis with fully-integrated FTIR & MS, high resolution TMA and DMA, plus DEA - dielectric analysis for thermoset cure monitoring. We also feature leading-edge technology for thermal conductivity by guarded hot plate and heat flow meters, laser flash thermal diffusivity measurement, thermal hazard screening via adiabatic reaction calorimetry, as well as refractories testing including HMOR, CIC, and RUL. Finally, we offer advanced software packages including thermokinetics for process modeling and development.

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Last update: 04/22/2009 , Copyright © 2000-2006 NETZSCH-Geraetebau GmbH